IEC TS 62239 pdf download – Process management for avionics – Preparation of an electronic components management plan

IEC TS 62239 pdf download – Process management for avionics – Preparation of an electronic components management plan

IEC TS 62239 pdf download – Process management for avionics – Preparation of an electronic components management plan
1 scope
This Technical Specification defines the requirements for developing an ElectronicComponents Management Plan (ECMP) to assure customers and regulatory agencies that allof the electronic components in the equipment of the plan owner are selected and applied incontrolled processes compatible with the end application and that the technical requirementsdetailed in Clause 4 are accomplished. In general,the owners of a complete electroniccomponents management plan are avionics equipment manufacturers.
2Normative references
The following referenced documents are indispensable for the application of this document.For dated references, only the edition cited applies. For undated references, the latest editionof the referenced document (including any amendments) applies.
IEC 61340-5-1:2007,Electrostatics – Part 5-1:Protection of electronic devices from electro-static phenomena – General requirements
IEC/TR 61340-5-2:2007,Electrostatics – Part 5-2: Protection of electronic devices fromelectrostatic phenomena – User guide
IEC/TR 62240,Process management for avionics – Use of semiconductor devices outsidemanufacturers’ specified temperature range
IEC/TS 62396 (all parts), Process management for avionics – Atmospheric radiation effects
IEC62402:2007,Obsolescence management – Application guide
JEP149 (Nov 2004),JEDEC Publication,JEDEC Standard Application Thermal DeratingMethodologies
JESD47,JEDEC Standard, Stress – Test-Driven Qualification of integrated circuits
JESD94.01,JEDEC Standard,Application Specific Qualification Using Knowledge Based TestMethodology
MIL-HDBK-263,Revision B Electrostatic Discharge Control Handbook
AEC-Q100, Failure Mechanism based Stress Test Qualification for Integrated Circuits
AEC-Q101,Stress Test Qualification for Automotive Grade discrete Semiconductors
AEC-Q200,Stress Test Qualification for Passive components
3Terms, definitions and abbreviations
3.1 Terms and definitions
For the purposes of this document, the following definitions apply.
NOTE Plan owners may use alternative definitions consistent with convention within their company in their plan.3.1.1
avionics equipment environment
applicable environmental conditions (as described per the equipment specification) that theequipment shall be able to withstand without loss or degradation in equipment performancethroughout its manufacturing cycle and maintenance life (the length of which is defined by theequipment manufacturer in conjunction with customers)
term used to indicate that a component can be used successfully in the intended application
indicates assessment and compliance to an applicable third party standard and maintenanceof a certificate and registration (i.e. JAN,IEcQ)
process of testing a sample of components to determine the key electrical parameter valuesthat can be expected of all produced components of the type tested
component application
process that assures that the component meets the design requirements of the equipment inwhich it is used
component manufacturer
organization responsible for the component specification and its production
component obsolescence management
range of management actions taken to avoid or resolve the effects of components not beingprocurable due to the manufacturer(s) ceasing production.Component obsolescence manage-ment should be considered an element of component dependability
component qualification
process used to demonstrate that the component is capable of meeting its specification for allthe required conditions and environments
component quality assurance
all activities and processes to provide adequate confidence that each individual componentmeets the performance and environmental requirements
component selection
process of choosing a specific component for a specific application
component standardization
process of developing and agreeing on (by consensus of decision) uniform engineeringcriteria for products and~methods for achieving compatibility, interoperability,interchangeability, or commonality of material
NOTE Standardizatlon is used to reduce proliferation of parts into inventory.3.1.12
capability of a product enabling it to achieve the specified functional performance at theappropriate time and for the planned duration,without damage to itself or its environment
NOTE Dependability is generally characterised by the following four parameters: reliability,maintainability ,avalability. safety.
organization contractually authorized by a manufacturer to store,split,repack and distributecompletely finished components which have been declared by the manufacturer asconforming to their specifications. The distributor is responsible for providing any technicalinformation and traceability information supplied by the component manufacturer
Electronic Components Management PlanECMP
equipment manufacturer’s document that defines the processes and practices for applyingcomponents to an equipment or range of equipment. Generally, it addresses all relevantaspects of controlling components during system design, development,production,and post-production support
electronic components
electrical or electronic devices that are not subject to disassembly without destruction orimpairment of design use. They are sometimes called electronic parts, or piece parts
EXAMPLES Resistors,capacitors,diodes,integrated circuits,hybrids,application specific integrated circuits,wound companents and relays.
component source facility
this is a subcontractor to an OEM that procures and supplies the components in accordancewith the requirements of IEC/TS62239
electronic equipment
item produced by the plan owner, which incorporates electronic components