IEC 62433-2 pdf download – EMC IC modelling – Part 2: Models of integrated circuits for EMI behavioural simulation – Conducted emissions modelling (ICEM-CE)

IEC 62433-2 pdf download – EMC IC modelling – Part 2: Models of integrated circuits for EMI behavioural simulation – Conducted emissions modelling (ICEM-CE)

IEC 62433-2 pdf download – EMC IC modelling – Part 2: Models of integrated circuits for EMI behavioural simulation – Conducted emissions modelling (ICEM-CE)
1 scope
This part of lEC 62433 specifies macro-models for ICs to simulate conducted electromagneticemissions on a printed circuit board. The model is commonly called Integrated CircuitEmission Model – Conducted Emission (ICEM-CE).
The ICEM-CE model can also be used for modelling an lC-die,a functional block and anlntellectual Property block(IP).
The ICEM-CE model can be used to model both digital and analogue lCs.Basically, conducted emissions have two origins:
conducted emissions through power supply terminals and ground reference structures;conducted emissions through inputloutput (l/O) terminals.
The ICEM-CE model addresses those two types of origins in a single approach.
This standard defines structures and components of the macro-model for EMl simulationtaking into account the lC’s internal activities.
This standard gives general data, which can be implemented in different formats or languagessuch as lBlS, iMIc,SPICE,VHDL-AMS and Verilog. SPICE is however chosen as defaultsimulation environment to cover all the conducted emissions.
This standard also specifies requirements for information that shall be incorporated in eachICEM-CE model or component part of the model for model circulation, but description syntaxis not within the scope of this standard.
2Normative references
The following referenced documents are indispensable for the application of this document.For dated references, only the edition cited applies. For undated references, the latest editionof the referenced document (including any amendments) applies.
IEC 61967 (all parts),Integrated Circuits – Measurement of electromagnetic emissions,150KHz to 1 GHz
IEC 61967-4,Integrated circuits – Measurement of electromagnetic emissions,150 kHz to 1GHz- Part 4: Measurement of conducted emissions -1 Q/150 Q direct coupling method
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
external terminal
terminal of an lC macro-model, which interfaces the model to the external environment of theIC,such as power supply pins and l/o pins
NOTE ln this document,the name of each external terminal starts with”ET”.3.2
internal terminal
terminal of an iC macro-model’s component,which interfaces the component to othercomponents of the lC macro-model
NOTE In this document, the name of each internal terminal starts with”IT””.
Integrated circuits will have more and more gates on silicon and technical progress willdevelop faster.To predict the electromagnetic behaviour of equipment, it is required to modelthe switching of the input and output interface and the internal activities of an integratedcircuit effectively.
Figure 1 depicts an example of decomposition of an lC to enable conducted emissionsanalysis. The internal digital activity (culprit) is a source of electromagnetic noise thatoriginates in switching of active devices. The coupling path propagates the emissions to theIC’s external terminals: pins/pads. The coupling path is the power distribution network or lOlines inside the lC.
4.2 Conducted emission from core activity (digital culprit) The current transients are created in the core area on the IC-die. Due to the characteristics of the digital coupling paths, the passive distribution network on printed circuit board (PCB) and the availability of on-chip decoupling, a portion of these current transients will occur at the power supply pins of the IC.
NOTE These off-chip power supply currents can be measured according to the lEC 61967 series.4.3Conducted emission from lo activity
I/Os activities may create voltage fluctuations of power and ground levels,and conductedemissions appear at power and ground pins through the l/Os’ coupling path.And the outputsignals at output pins themselves are sources of conducted emissions to the printed circuitboards.
NOTE The measurement set-up is done according to the lEC 61967 series.5Basic components
5.1 General
The basic components are component parts of the IC macro-model or block component orsub-model component. The following subclauses define the basic components.
NOTE The block component and the sub-model component are defined in Subclause 6.3.1 and 6.4.1 respectively.5.2lnternal Activity (IA)
The Internal Activity (1A) component is the electromagnetic noise source that originates inswitching of active devices in the lC or in a portion of the IC.This component is applicable forboth analogue and digital circuitry.
The lA is described using an independent current source or an independent voltage sourcewith two internal terminals as shown in Figure 2.