IEC 61249-3-5 pdf download – Materials for printed boards and other interconnecting structures – Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) – Transfer adhesive films

IEC 61249-3-5 pdf download – Materials for printed boards and other interconnecting structures – Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) – Transfer adhesive films
1Scope
This part of lEC 61249 gives requirements for transfer adhesive films for use in the fabricationof flexible multilayer boards or flex-rigid printed boards.
2Normative references
The following normative documents contain provisions which, through reference in this text,constitute provisions of this part of lEC 61249.For dated references,subsequent amendmentsto , or revisions of, any of these publications do not apply. However, parties to agreementsbased on this part of iEC 61249 are encouraged to investigate the possibility of applying
the most recent editions of the normative documents indicated below.For undated references,the latest edition of the normative document referred to applies.Members of lEC and lSomaintain registers of currently valid lnternational Standards.
IEC 60249-1:1982,Base materials for printed circuits – Part 1: Test methods
IEC 60249-2-8:1987,Base materials for printed circuits – Part 2: Specifications – SpecificationNo.8: Flexible copper-clad polyester (PETP) film
IEC 60249-2-13:1987,Base materials for printed circuits – Part 2: Specifications -Specification No.13: Flexible copper-clad polyimide film, general purpose gradeIEC 60249-2-15:1987,Base materials for printed circuits – Part 2: Specifications -Specification No.15: Flexible copper-clad polyimide film of defined flammability
IEC 61189-2:1997,Test methods for electrical material interconnection structures andassemblies – Part 2:Test methods for materials for interconnection structures
3Materials and construction
The materials consist of adhesive layers based on B-staged epoxide, acrylic or polyester (PET)resin supported by a removable paper carrier and protected by a polymeric release film whichshall adhere until lamination.
The adhesive on epoxide or acrylic base shall be compatible with the copper-clad polyimidefilms according to lEC 60249-2-13 and IEC 60249-2-15; the adhesive on polyester (PET) baseshall be compatible with the copper-clad polyester films according to lEC 60249-2-8.