IEC 60317-4 pdf download – Specifications for particular types of winding wires – Part 4: Solderable polyurethane enamelled round copper wire, class 1 30

IEC 60317-4 pdf download – Specifications for particular types of winding wires – Part 4: Solderable polyurethane enamelled round copper wire, class 1 30
1 Scope
This International Standard specifies the requirements of solderable enamelled round copperwinding wire of class 130 with a sole coating based on polyurethane resin,which may bemodified provided it retains the chemical identity of the original resin and meets all specifiedwire requirements.
NOTE A modified resin is a resin that has undergone a chemical change,or contains one or more additives toenhance cerlain performance or application characteristics.
Class 130 is a thermal class that requires a minimum temperature index of 130 and a heatshock temperature of at least 155“C.
The temperature in degrees Celsius corresponding to the temperature index is not necessarilythat at which it is recommended that the wire be operated and this will depend on manyfactors, including the type of equipment involved.
The range of nominal conductor diameters covered by this standard is:- Grade 1 : 0,018 mm up to and including 2,000 mm;
– Grade 2: 0,020 mm up to and including 2,000 mm.
The nominal conductor diameters are specified in clause 4 of lEC 60317-O-1.
Normative references
The following standard contains provisions which，through reference in this text,constituteprovisions of this International Standard.At the time of publication, the edition indicated wasvalid. All standards are subject to revision，and parties to agreements based on thisInternational Standard are encouraged to investigate the possibility of applying the mostrecent edition of the standard indicated below.Members of lEC and lso maintain registers ofcurrently valid international standards.
IEC 60317-0-1:1990，Specifications for particular types of winding wires – Part 0: Generalrequiremenfs – Section ‘1 : Enameled round copper wire
3Definitions and general notes on methods of test
For definitions and general notes on methods of test see clause 3 of lEC 60317-0-1.
In case of inconsistencies between lEC 60317-0-1 and this standard，IEC 60317-4 shallprevail.
4 Dimensions
See clause 4 of IEC 6031 7-0-1 .
5 Electrical resistance
See clause 5 of IEC 6031 7-0-1 .
6 Elongation
See clause 6 of IEC 6031 7-0-1 .
7 Springiness
See clause 7 of IEC 6031 7-0-1 .
8 Flexibility and adherence
See clause 8 of IEC 6031 7-0-1 , where the constant K used for the calculation of the number of revolutions for the peel test shall be 1 50 mm.
9 Heat shock
See clause 9 of IEC 6031 7-0-1 , where the minimum heat shock temperature shall be 1 55 °C.
1 0 Cut-through
No failure shall occur within 2 min at 1 70 °C.
1 1 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to and including 2,000 mm)
The wire shall meet the requirements given in table 1
1 2 Resistance to solvents
See clause 1 2 of IEC 6031 7-0-1 .
1 3 Breakdown voltage
See clause 1 3 of IEC 6031 7-0-1 , where the elevated temperature shall be 1 30 °C.
1 4 Continuity of insulation
See clause 1 4 of IEC 6031 7-0-1 .
1 5 Temperature index
See clause 1 5 of IEC 6031 7-0-1 , where the minimum temperature index shall be 1 30.
1 6 Resistance to refrigerants
Test inappropriate.
1 7 Solderability
1 7.1 Nominal conductor diameters up to and including 0,050 mm
The temperature of the solder bath shall be 375 ± 5 °C. The maximum immersion time shall be 2 s.
The surface of the tinned wire shall be smooth and free from holes and enamel residues.
1 7.2 Nominal conductor diameters over 0,050 mm up to and including 0,1 00 mm The temperature of the solder bath shall be 375 ± 5 °C. The maximum immersion time shall be 2 s.
The surface of the tinned wire shall be smooth and free from holes and enamel residues.
1 7.3 Nominal conductor diameter over 0,1 00 mm
The temperature of the solder bath shall be (375 ± 5) °C. The maximum immersion time (in seconds) shall be the following multiple of the nominal conductor diameter (in millimetres) with a minimum of 2 s.
The surface of the tinned wire shall be smooth and free from holes and enamel residues.
1 8 Heat or solvent bonding
Test inappropriate.
1 9 Dielectric dissipation factor
The dielectric loss tangent at approximately 1 MHz shall not exceed 300 × 1 0 –4 .
NOTE This test is only applicable to wires to be used in high frequency coils.
20 Resistance to transformer oil
Test inappropriate.
21 Loss of mass
Test inappropriate.
30 Packaging
See clause 30 of IEC 6031 7-0-1 .